Description
Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It is a high strength adhesive and produces bonds that are both tough and durable. It resists thermal cycling and many chemicals including water, fuels and most organic solvents. It has a service temperature range of 4K up to 400°F. It adheres well to metals, glass, ceramics, rubbers and many plastics. The hardened adhesive exhibits high thermal conductivity and superior electrical insulation. The thermal expansion coefficient is remarkably low. EP21TCHT-1 is widely used in aerospace, electronics, electronic, automotive and chemical industries. As a NASA qualified system, it is ideal for high vacuum type applications, particularly those where elevated temperature cures are not possible. It also passes MIL-STD-810G for fungal resistance, and withstands 1,000 hours at 85°C/85% RH.